Microwave Characterization of Copper-Clad Dielectric Laminate Substrates Yoshio KOBAYASHI
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2007/12/01 Vol. E90-CNo. 12 ;
pp. 2178-2184 Type of Manuscript: INVITED PAPER (Special Section on Recent Technologies for Microwave and Millimeter-wave Passive Devices) Category: Keyword: microwave measurement, complex permittivity, conductivity, dielectric substrates,