Keyword : defect observation

An Analysis of and a Method of Enhancing the Intensity of OBIRCH Signal for Defects Observation in VLSI Metal Interconnections
Naoki KAWAMURA Tomoaki SAKAI Masakazu SHIMAYA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/04/25
Vol. E77-C  No. 4 ; pp. 579-584
Type of Manuscript:  Special Section PAPER (Special Issue on LSI Failure Analysis)
OBIRCHVLSI interconnectionfailure analysisdefect observationlaser scanning microscopeOBIC
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