Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1994/02/25
Vol. E77-C
No. 2 ;
pp. 124-128
Type of Manuscript:
Special Section PAPER (Special Issue on 1993 VLSI Process and Device Modeling Workshop (VPAD 93))
Category: Process Simulation
Keyword:
trench isolation, shallow trench, deep trench, high-speed bipolar LSIs, leakage current, mechanical stress, |
