Keyword : copper


Chip-Level Performance Maximization Using ASIS (Application-Specific Interconnect Structure) Wiring Design Concept for 45 nm CMOS Generation
Noriaki ODA Hironori IMURA Naoyoshi KAWAHARA Masayoshi TAGAMI Hiroyuki KUNISHIMA Shuji SONE Sadayuki OHNISHI Kenta YAMADA Yumi KAKUHARA Makoto SEKINE Yoshihiro HAYASHI Kazuyoshi UENO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2007/04/01
Vol. E90-C  No. 4 ; pp. 848-855
Type of Manuscript:  Special Section PAPER (Special Section on Low-Power, High-Speed LSIs and Related Technologies)
Category: Device
Keyword: 
copperlow-kCMOSinterconnectdesignapplication
 Summary | Full Text:PDF

Chip-Level Performance Improvement Using Triple Damascene Wiring Design Concept for the 0.13 µm CMOS Generation and Beyond
Noriaki ODA Hiroyuki KUNISHIMA Takashi KYOUNO Kazuhiro TAKEDA Tomoaki TANAKA Toshiyuki TAKEWAKI Masahiro IKEDA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2006/11/01
Vol. E89-C  No. 11 ; pp. 1544-1550
Type of Manuscript:  Special Section PAPER (Special Section on Novel Device Architectures and System Integration Technologies)
Category: 
Keyword: 
copperCMOSdamascenedesign
 Summary | Full Text:PDF

Spectroscopic Determination of Temperature and Metal-Vapor for Copper Breaking Arc by Using a CCD Color Camera and an Additional Filter
Mitsuru TAKEUCHI Takayoshi KUBONO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2000/09/25
Vol. E83-C  No. 9 ; pp. 1377-1384
Type of Manuscript:  Special Section PAPER (Special Issue on Current Electromechanical Devices and Their Materials with Recent Innovations)
Category: 
Keyword: 
arc dischargecopperspectroscopytemperaturemetal-vapor
 Summary | Full Text:PDF

Evalution of the SO2 and NO2 Mixed Gas Tests for Electronic Parts
Sadao IDA Atsumi KURAMOCHI Hiroshi WATANABE Mitsuhiko KOYAMA Kazutoshi GOTO 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 1994/01/25
Vol. E77-A  No. 1 ; pp. 204-207
Type of Manuscript:  Special Section PAPER (Special Section on Reliability)
Category: Reliability Testing
Keyword: 
corrosionmixed gas testcopper
 Summary | Full Text:PDF

Microwave Characteristics of Alumina-Glass Composite Multi-Layer Substrates with Co-fired Copper Conductors
Yutaka TAGUCHI Katsuyuki MIYAUCHI Kazuo EDA Toru ISHIDA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1993/06/25
Vol. E76-C  No. 6 ; pp. 912-918
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functions and Size-Reductions)
Category: 
Keyword: 
multi-layermicrowavealumina ceramicscopper
 Summary | Full Text:PDF