Keyword : copper balls

60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules
Satoshi YOSHIDA Shoichi TANIFUJI Suguru KAMEDA Noriharu SUEMATSU Tadashi TAKAGI Kazuo TSUBOUCHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/07/01
Vol. E95-C  No. 7 ; pp. 1276-1284
Type of Manuscript:  PAPER
Category: Microwaves, Millimeter-Waves
Keyword: 
millimeter-wave, 60-GHz band, system-in-package, vertical interconnection, copper balls, WPAN, 
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