Keyword : components

Using Hierarchical Scenarios to Predict the Reliability of Component-Based Software
Chunyan HOU Jinsong WANG Chen CHEN 
Publication:   
Publication Date: 2018/02/01
Vol. E101-D  No. 2 ; pp. 405-414
Type of Manuscript:  PAPER
Category: Software Engineering
Keyword: 
scenario, software reliability, software architecture, components, 
 Summary | Full Text:PDF
Process Synthesis Using TCAD: A Mixed-Signal Case Study
Michael SMAYLING John RODRIGUEZ Alister YOUNG Ichiro FUJII 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/06/25
Vol. E82-C  No. 6 ; pp. 983-991
Type of Manuscript:  INVITED PAPER (Special Issue on TCAD for Semiconductor Industries)
Category: 
Keyword: 
process integration, process recipes, components, mixed-signal process, flash memory, LDMOS, ESD circuit, 
 Summary | Full Text:PDF
Switching Converter Using Thin-Film Microtransformer with Monolithically Integrated Rectifier Diodes
Masato MINO Toshiaki YACHI Keiichi YANAGISAWA Akio TAGO Kazuhiko SAKAKIBARA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/06/25
Vol. E80-C  No. 6 ; pp. 821-827
Type of Manuscript:  PAPER
Category: Components
Keyword: 
components, integrated electronics, material, forward converter, thin-film magnetic device, 
 Summary | Full Text:PDF
Influence of Cross-Sectional Deformation on Coplanar Waveguide Characteristics for the Use of Optical Modulator
Xiang ZHANG Tanroku MIYOSHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/11/25
Vol. E77-C  No. 11 ; pp. 1766-1770
Type of Manuscript:  Special Section PAPER (Special Issue on Electromagnetic Theory)
Category: 
Keyword: 
opto-electronics, microwave and millimeter wave technology, components, electromagnetic theory, 
 Summary | Full Text:PDF
Recent Development of Testing System for Arcing Contacts
Hideaki SONE Tasuku TAKAGI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10 ; pp. 1545-1552
Type of Manuscript:  INVITED PAPER (Special Issue on Recent Electromechanical Devices)
Category: 
Keyword: 
materials, components, electric contact, measurement, arc discharge, 
 Summary | Full Text:PDF
High-Density, High-Pin-Count Flexible SMD Connector for High-Speed Data Bus
Shinichi SASAKI Tohru KISHIMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10 ; pp. 1694-1701
Type of Manuscript:  PAPER
Category: Components
Keyword: 
components, connector, surface mount device (SMD), FPC cable, MCM, 
 Summary | Full Text:PDF