Capacitance Extraction of Three-Dimensional Interconnects Using Element-by-Element Finite Element Method (EBE-FEM) and Preconditioned Conjugate Gradient (PCG) Technique Jianfeng XUHong LIWen-Yan YINJunfa MAOLe-Wei LI
Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2006/04/01 Vol. E89-ANo. 4 ;
pp. 847-855 Type of Manuscript: Special Section PAPER (Special Section on Selected Papers from the 18th Workshop on Circuits and Systems in Karuizawa) Category: Keyword: dummy fill, capacitance extraction, capacitance formula, interconnect,
Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2006/04/01 Vol. E89-ANo. 4 ;
pp. 856-864 Type of Manuscript: Special Section PAPER (Special Section on Selected Papers from the 18th Workshop on Circuits and Systems in Karuizawa) Category: Keyword: interconnect, worst-case delay, static timing analysis, process variation, capacitance extraction,
Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2005/12/01 Vol. E88-ANo. 12 ;
pp. 3453-3462 Type of Manuscript: Special Section PAPER (Special Section on VLSI Design and CAD Algorithms) Category: Interconnect Keyword: capacitance formula, capacitance calculation, capacitance extraction, interconnect capacitance,
Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2005/11/01 Vol. E88-ANo. 11 ;
pp. 3180-3187 Type of Manuscript: PAPER Category: VLSI Design Technology and CAD Keyword: dummy fill, dummy metal, capacitance extraction, interconnect capacitance,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2000/08/25 Vol. E83-CNo. 8 ;
pp. 1349-1355 Type of Manuscript: Special Section PAPER (Special Issue on 1999 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD'99)) Category: Numerics Keyword: NURBS surface, mesh generation, advancing front, topography simulation, capacitance extraction,