Keyword : bump

A 3-D Packaging Technology with Highly-Parallel Memory/Logic Interconnect
Yoichiro KURITA Koji SOEJIMA Katsumi KIKUCHI Masatake TAKAHASHI Masamoto TAGO Masahiro KOIKE Koujirou SHIBUYA Shintaro YAMAMICHI Masaya KAWANO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2009/12/01
Vol. E92-C  No. 12 ; pp. 1512-1522
Type of Manuscript:  PAPER
Category: Electronic Components
Keyword: 
three-dimensional package, inter-chip connections, wide-band communication, fine interposer, bump, interconnection, 
 Summary | Full Text:PDF
High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs
Hiroyuki SAKAI Takayuki YOSHIDA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C  No. 6 ; pp. 810-818
Type of Manuscript:  INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword: 
flip-chip, bump, HIC (Hybrid IC), microwave, millimeter-wave, 
 Summary | Full Text:PDF
A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology
Hiroyuki SAKAI Yorito OTA Kaoru INOUE Takayuki YOSHIDA Kazuaki TAKAHASHI Suguru FUJITA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/08/25
Vol. E78-C  No. 8 ; pp. 971-978
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology)
Category: 
Keyword: 
millimeter-wave, flip-chip, IC (Integrated Circuit), microstrip line, bump, 
 Summary | Full Text:PDF