Keyword : ball grid array


MILP-Based Efficient Routing Method with Restricted Route Structure for 2-Layer Ball Grid Array Packages
Yoichi TOMIOKA Yoshiaki KURATA Yukihide KOHIRA Atsushi TAKAHASHI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/12/01
Vol. E92-A  No. 12 ; pp. 2998-3006
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Desing
Keyword: 
ball grid arraymonotonicnearest via assignmentpackage routingradiate
 Summary | Full Text:PDF

Routability Driven Via Assignment Method for 2-Layer Ball Grid Array Packages
Yoichi TOMIOKA Atsushi TAKAHASHI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/06/01
Vol. E92-A  No. 6 ; pp. 1433-1441
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
ball grid arraymonotonicpackage routingvia assignment
 Summary | Full Text:PDF

Routing of Monotonic Parallel and Orthogonal Netlists for Single-Layer Ball Grid Array Packages
Yoichi TOMIOKA Atsushi TAKAHASHI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2006/12/01
Vol. E89-A  No. 12 ; pp. 3551-3559
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Design
Keyword: 
ball grid arraymonotonicsingle-layerpackagerouting
 Summary | Full Text:PDF

A Via Assignment and Global Routing Method for 2-Layer Ball Grid Array Packages
Yukiko KUBO Atsushi TAKAHASHI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2005/05/01
Vol. E88-A  No. 5 ; pp. 1283-1289
Type of Manuscript:  Special Section PAPER (Special Section on Discrete Mathematics and Its Applications)
Category: 
Keyword: 
ball grid arraymonotonic routingvia assignmentwire congestiontotal wire lengthheuristic
 Summary | Full Text:PDF

Microwave Frequency Model of FPBGA Solder Ball Extracted from S-Parameters Measurement
Junho LEE Seungyoung AHN Woon-Seong KWON Kyung-Wook PAIK Joungho KIM 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2004/09/01
Vol. E87-C  No. 9 ; pp. 1621-1627
Type of Manuscript:  PAPER
Category: Electronic Components
Keyword: 
ball grid arrayfine pitched BGAlumped circuit modelmicrowave frequencyS-parameters
 Summary | Full Text:PDF