Keyword : assembly


A Retrieval Method for 3D CAD Assembly Models Using 3D Radon Transform and Spherical Harmonic Transform
Kaoru KATAYAMA Takashi HIRASHIMA 
Publication:   
Publication Date: 2020/05/01
Vol. E103-D  No. 5 ; pp. 992-1001
Type of Manuscript:  Special Section PAPER (Special Section on Data Engineering and Information Management)
Category: 
Keyword: 
3D CAD modelassemblyretrievallayout of component3D Radon transformspherical harmonic transform
 Summary | Full Text:PDF(3.2MB)

Subassembly Retrieval of 3D CAD Assembly Models with Different Layout of Components Based on Sinogram
Kaoru KATAYAMA Wataru SATO 
Publication:   
Publication Date: 2019/04/01
Vol. E102-D  No. 4 ; pp. 777-787
Type of Manuscript:  Special Section PAPER (Special Section on Data Engineering and Information Management)
Category: 
Keyword: 
3D CAD modelassemblysubassemblyretrievallayout of componentsinogram
 Summary | Full Text:PDF(3.3MB)

High-Speed MT Connector Assembly Method
Koji SHIBATA Masaaki TAKAYA Kazuo HOGARI Izumi SANKAWA Tadashi HAIBARA 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2006/02/01
Vol. E89-B  No. 2 ; pp. 413-418
Type of Manuscript:  PAPER
Category: Optical Fiber for Communications
Keyword: 
connectorsoptical fibersassemblyoptical communicationoptical components
 Summary | Full Text:PDF(1.1MB)

Timed Petri Net Based Scheduling for Mechanical Assembly Integration of Planning and Scheduling
Akio INABA Fumiharu FUJIWARA Tatsuya SUZUKI Shigeru OKUMA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 1998/04/25
Vol. E81-A  No. 4 ; pp. 615-625
Type of Manuscript:  Special Section PAPER (Special Section on Concurrent Systems Technology)
Category: 
Keyword: 
schedulingtimed Petri netassembly
 Summary | Full Text:PDF(829.9KB)

Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method
Tadatomo SUGA Yuzo ISHII Naoe HOSODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/02/25
Vol. E80-C  No. 2 ; pp. 297-302
Type of Manuscript:  Special Section PAPER (Special Issue on Micromachine Technology)
Category: Fabrication
Keyword: 
bondingsurface activated bondingassemblymicro-systemintegrationMEMSmicromachineWWW
 Summary | Full Text:PDF(1.1MB)