Keyword : TSV

Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the Power of Interconnections and Pads
Yung-Hao LAI Yang-Lang CHANG Jyh-Perng FANG Lena CHANG Hirokazu KOBAYASHI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2016/06/01
Vol. E99-A  No. 6 ; pp. 1206-1215
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
3D-IC, TSV, partitioning, area-overhead reduction, power consumption, 
 Summary | Full Text:PDF(2.8MB)
A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel
Li-Chung HSU Junichiro KADOMOTO So HASEGAWA Atsutake KOSUGE Yasuhiro TAKE Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2015/12/01
Vol. E98-A  No. 12 ; pp. 2584-2591
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Design
Keyword: 
TCI, ThruChip, 3-D IC, TSV, inductive coupling interface, 
 Summary | Full Text:PDF(6.3MB)
Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration
Li-Chung HSU Masato MOTOMURA Yasuhiro TAKE Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2015/04/01
Vol. E98-C  No. 4 ; pp. 288-297
Type of Manuscript:  Special Section PAPER (Special Section on Solid-State Circuit Design---Architecture, Circuit, Device and Design Methodology)
Category: 
Keyword: 
TCI, ThruChip, 3-D FPGA, TSV, FPGA, TPR, VPR, 
 Summary | Full Text:PDF(2.7MB)
Through-Silicon-Via Characterization and Modeling Using a Novel One-Port De-Embedding Technique
An-Sam PENG Ming-Hsiang CHO Yueh-Hua WANG Meng-Fang WANG David CHEN Lin-Kun WU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2013/10/01
Vol. E96-C  No. 10 ; pp. 1289-1293
Type of Manuscript:  Special Section PAPER (Special Section on Emerging Technologies and Applications for Microwave and Millimeter-Wave Systems)
Category: 
Keyword: 
3D IC, TSV, de-embedding, TEGs, microwave, RF modeling, 
 Summary | Full Text:PDF(1.6MB)
Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs
Kan WANG Sheqin DONG Yuchun MA Yu WANG Xianlong HONG Jason CONG 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2011/12/01
Vol. E94-A  No. 12 ; pp. 2490-2498
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Design
Keyword: 
leakage power, TSV, delay-power-temperature dependence, 
 Summary | Full Text:PDF(2.7MB)