| Keyword : TSV
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Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration Li-Chung HSU Masato MOTOMURA Yasuhiro TAKE Tadahiro KURODA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2015/04/01
Vol. E98-C
No. 4 ;
pp. 288-297
Type of Manuscript:
Special Section PAPER (Special Section on Solid-State Circuit Design---Architecture, Circuit, Device and Design Methodology)
Category: Keyword: TCI, ThruChip, 3-D FPGA, TSV, FPGA, TPR, VPR, | | Summary | Full Text:PDF(2.7MB) | |
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