Keyword : TSV assignment


An Efficient Multi-Level Algorithm for 3D-IC TSV Assignment
Cong HAO Takeshi YOSHIMURA 
Publication:   
Publication Date: 2017/03/01
Vol. E100-A  No. 3 ; pp. 776-784
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
3D-ICTSV assignmentmulti commodity flow
 Summary | Full Text:PDF(1.6MB)