Keyword : TSV (Through Silicon Via)


TSV Geometrical Variations and Optimization Metric with Repeaters for 3D IC
Hung Viet NGUYEN Myunghwan RYU Youngmin KIM 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/12/01
Vol. E95-C  No. 12 ; pp. 1864-1871
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
3D ICTSV (Through Silicon Via)powerdelayoptimizationinterconnectrepeater
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