Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2015/04/01
Vol. E98-C
No. 4 ;
pp. 288-297
Type of Manuscript:
Special Section PAPER (Special Section on Solid-State Circuit Design---Architecture, Circuit, Device and Design Methodology)
Category:
Keyword:
TCI, ThruChip, 3-D FPGA, TSV, FPGA, TPR, VPR, |
