Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2013/10/01
Vol. E96-C
No. 10 ;
pp. 1289-1293
Type of Manuscript:
Special Section PAPER (Special Section on Emerging Technologies and Applications for Microwave and Millimeter-Wave Systems)
Category:
Keyword:
3D IC, TSV, de-embedding, TEGs, microwave, RF modeling, |
