Publication: IEICE TRANSACTIONS on Communications
Publication Date: 2010/07/01
Vol. E93-B
No. 7 ;
pp. 1670-1677
Type of Manuscript:
INVITED PAPER (Special Section on Advanced Electromagnetic Compatibility Technology in Conjunction with Main Topics of EMC'09/Kyoto)
Category:
Keyword:
decoupling capacitor, integrated circuits (ICs), power distribution network (PDN), printed circuit board (PCB), radiated and conducted emission, SPICE circuit simulator, |