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Introduction to Latest RF ATE with Low Test Cost Solutions
Masayuki KIMISHIMA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2012/07/01
Vol. E95-C
No. 7 ;
pp. 1147-1153
Type of Manuscript:
INVITED PAPER (Special Section on Recent Trends of Microwave Systems and Their Fundamental Technologies)
Category:
Keyword:
ATE, SoC tester, SIP, calibration, LTCC, MMIC, | | | Summary | Full Text:PDF | |
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VoIP Quality Measurement System Using Flow Mediation for Large-Scale IP Networks
Atsushi KOBAYASHI Keisuke ISHIBASHI | Publication: IEICE TRANSACTIONS on Communications
Publication Date: 2011/07/01
Vol. E94-B
No. 7 ;
pp. 1973-1981
Type of Manuscript:
PAPER
Category: Network Management/Operation
Keyword:
IPFIX, PSAMP, sFlow, VoIP, SIP, | | | Summary | Full Text:PDF | |
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Extended Password Recovery Attacks against APOP, SIP, and Digest Authentication
Yu SASAKI Lei WANG Kazuo OHTA Noboru KUNIHIRO | Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/01/01
Vol. E92-A
No. 1 ;
pp. 96-104
Type of Manuscript:
Special Section PAPER (Special Section on Cryptography and Information Security)
Category: Hash Function
Keyword:
APOP, SIP, digest authentication, IV bridge, collision attack, hash function, MD5, | | | Summary | Full Text:PDF | |
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An Efficient Scheme for Supporting Personal Mobility in SIP-Based VoIP Services
Tsan-Pin WANG KauLin CHIU | Publication: IEICE TRANSACTIONS on Communications
Publication Date: 2006/10/01
Vol. E89-B
No. 10 ;
pp. 2706-2714
Type of Manuscript:
Special Section PAPER (Special Section on Mobile Multimedia Communications)
Category:
Keyword:
VoIP, SIP, personal mobility, | | | Summary | Full Text:PDF | |
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Packaging Technology Trends and Challenges for System-in-Package
Akihiro DOHYA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C
No. 12 ;
pp. 1756-1762
Type of Manuscript:
INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category:
Keyword:
packaging technology, system-in-package, SIP, SoC, CSP, | | | Summary | Full Text:PDF | |
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The Dawn of 3D Packaging as System-in-Package (SIP)
Morihiro KADA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C
No. 12 ;
pp. 1763-1770
Type of Manuscript:
INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category:
Keyword:
3D package, SIP, CSP, stacked CSP, cellular phone, | | | Summary | Full Text:PDF | |
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