Keyword : OBIRCH


Novel via Chain Structure for Failure Analysis at 65 nm-Node Fixing OPC Using Inner and Outer via Chain Dummy Patterns
Takashi NASUNO Yoshihisa MATSUBARA Hiromasa KOBAYASHI Akiyuki MINAMI Eiichi SODA Hiroshi TSUDA Koichiro TSUJITA Wataru WAKAMIYA Nobuyoshi KOBAYASHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2005/05/01
Vol. E88-C  No. 5 ; pp. 796-803
Type of Manuscript:  Special Section PAPER (Special Section on Microelectronic Test Structures)
Category: 
Keyword: 
test structure65 nm-nodevia chainOBIRCHfailure analysis
 Summary | Full Text:PDF(2.6MB)

An Analysis of and a Method of Enhancing the Intensity of OBIRCH Signal for Defects Observation in VLSI Metal Interconnections
Naoki KAWAMURA Tomoaki SAKAI Masakazu SHIMAYA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/04/25
Vol. E77-C  No. 4 ; pp. 579-584
Type of Manuscript:  Special Section PAPER (Special Issue on LSI Failure Analysis)
Category: 
Keyword: 
OBIRCHVLSI interconnectionfailure analysisdefect observationlaser scanning microscopeOBIC
 Summary | Full Text:PDF(544.5KB)