Keyword : Nastran


Modeling and Simulation of Hermetically Sealed Electromagnetic Relay under Mechanical Environment
Wanbin REN Yinghua CHEN Guofu ZHAI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2007/07/01
Vol. E90-C  No. 7 ; pp. 1448-1454
Type of Manuscript:  Special Section PAPER (Special Section on Recent Development of Electromechanical Devices (Selected Papers from ICEC2006))
Category: Relays & Switches
Keyword: 
finite element modelingnormal mode analysisdynamics responseNastranhermetically sealed electromagnetic relay
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