Keyword : LSI chip-package-board co-design


AC Power Supply Noise Simulation of CMOS Microprocessor with LSI Chip-Package-Board Integrated Model
Kumpei YOSHIKAWA Kouji ICHIKAWA Makoto NAGATA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2014/04/01
Vol. E97-C  No. 4 ; pp. 264-271
Type of Manuscript:  Special Section PAPER (Special Section on Solid-State Circuit Design,---,Architecture, Circuit, Device and Design Methodology)
Category: 
Keyword: 
power supply noiseelectromagnetic compatibilityLSI chip-package-board co-designpower integrity
 Summary | Full Text:PDF(2.9MB)

Co-simulation of On-Chip and On-Board AC Power Noise of CMOS Digital Circuits
Kumpei YOSHIKAWA Yuta SASAKI Kouji ICHIKAWA Yoshiyuki SAITO Makoto NAGATA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2012/12/01
Vol. E95-A  No. 12 ; pp. 2284-2291
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Device and Circuit Modeling and Analysis
Keyword: 
LSI chip-package-board co-designelectromagnetic compatibilitypower supply noisepower delivery network
 Summary | Full Text:PDF(2.3MB)