Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C
No. 6 ;
pp. 801-809
Type of Manuscript:
INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword:
microwave, mm-wave, IC package, EM simulation, FDTD, PEE, diakoptics, |
