Keyword : IC package

Frequency Domain Diakoptics for IC Packaging Structures Based on the PEE and FDTD Methods
Tsugumichi SHIBATA Tatsuo ITOH 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C  No. 6 ; pp. 801-809
Type of Manuscript:  INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
microwavemm-waveIC packageEM simulationFDTDPEEdiakoptics
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