Keyword : HIC (Hybrid IC)


High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs
Hiroyuki SAKAI Takayuki YOSHIDA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C  No. 6 ; pp. 810-818
Type of Manuscript:  INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword: 
flip-chipbumpHIC (Hybrid IC)microwavemillimeter-wave
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