Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C
No. 6 ;
pp. 810-818
Type of Manuscript:
INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword:
flip-chip, bump, HIC (Hybrid IC), microwave, millimeter-wave, |
