| Keyword : HEMT
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Analysis of Passivation-Film-Induced Stress Effects on Electrical Properties in AlGaN/GaN HEMTs Naoteru SHIGEKAWA Suehiro SUGITANI | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2010/08/01
Vol. E93-C
No. 8 ;
pp. 1212-1217
Type of Manuscript:
Special Section PAPER (Special Section on Heterostructure Microelectronics with TWHM 2009)
Category: GaN-based Devices Keyword: GaN, HEMT, threshold voltage, piezoelectric effects, film stress, | | Summary | Full Text:PDF(586.5KB) | |
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InP HEMT Technology for High-Speed Logic and Communications Tetsuya SUEMITSU Masami TOKUMITSU | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2007/05/01
Vol. E90-C
No. 5 ;
pp. 917-922
Type of Manuscript:
Special Section PAPER (Special Section on Fundamentals and Applications of Advanced Semiconductor Devices)
Category: Compound Semiconductor and Power Devices Keyword: HEMT, InP, cutoff frequency, OEIC, | | Summary | Full Text:PDF(990.1KB) | |
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High Power GaN-HEMT for Wireless Base Station Applications Toshihide KIKKAWA Kazukiyo JOSHIN | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2006/05/01
Vol. E89-C
No. 5 ;
pp. 608-615
Type of Manuscript:
Special Section PAPER (Special Section on Fundamental and Application of Advanced Semiconductor Devices)
Category: Compound Semiconductor Devices Keyword: GaN, HEMT, base station, amplifier, W-CDMA, | | Summary | Full Text:PDF(1.6MB) | |
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A V-band Monolithic HEMT Amplifier Using Two Types of RF Grounds Naoko ONO | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2004/06/01
Vol. E87-C
No. 6 ;
pp. 1010-1012
Type of Manuscript:
Special Section LETTER (Special Section on Analog Circuit and Device Technologies)
Category: Keyword: RF ground, HEMT, coplanar waveguide, amplifier, V-band, | | Summary | Full Text:PDF(261.8KB) | |
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Analytical Expressions for Maximum Operating Frequencies of Emitter-Coupled Logic and Source-Coupled FET Logic Toggle Flip-Flops Eiichi SANO | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2003/09/01
Vol. E86-C
No. 9 ;
pp. 1879-1885
Type of Manuscript:
PAPER
Category: Electronic Circuits Keyword: bipolar transistor, HBT, HEMT, digital circuit, propagation delay, flip-flop, | | Summary | Full Text:PDF(620.3KB) | |
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InP-Based Lightwave Communication ICs for 40 Gbit/s and Beyond Eiichi SANO Yasuro YAMANE | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C
No. 11 ;
pp. 1879-1885
Type of Manuscript:
INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: Information and Communication System Keyword: InP, HEMT, analog IC, digital IC, packaging, | | Summary | Full Text:PDF(2MB) | |
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Application of 1.55-µm Photonic Technology to Practical Millimeter-Wave Network Analysis Nabil SAHRI Tadao NAGATSUMA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1999/07/25
Vol. E82-C
No. 7 ;
pp. 1307-1311
Type of Manuscript:
Special Section PAPER (Special Issue on Microwave and Millimeter Wave Technology)
Category: Measurements Keyword: millimeter wave, network-analyzer, electro-optic sampling, HEMT, | | Summary | Full Text:PDF(987.8KB) | |
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Design of a K-Band Power Amplifier Using On-Wafer-Tuning Load-Pull Method Minoru IDA Masashi NAKATSUGAWA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C
No. 6 ;
pp. 882-885
Type of Manuscript:
Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Semiconductor Devices and Amplifiers Keyword: power amplifier, load-pull measurement, on-wafer, MMIC, HEMT, | | Summary | Full Text:PDF(550.1KB) | |
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N-InAlAs/InGaAs HEMT DCFL Inverter Fabricated Using Pt-Based Gate and Photochemical Dry Etching Naoki HARADA Shigeru KURODA Kohki HIKOSAKA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1992/10/25
Vol. E75-C
No. 10 ;
pp. 1165-1171
Type of Manuscript:
Special Section PAPER (Special Issue on Compound Semiconductor Integrated Circuits)
Category: Keyword: HEMT, InGaAs, Schottky junction, DCEL, dry etching, | | Summary | Full Text:PDF(559.3KB) | |
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