Keyword : Cu


Experimental Study on Root Profile of Molten Bridge under Different Current at Low Opening Speed
Xinyun ZHANG Xue ZHOU Xinglei CUI Rui LI Guofu ZHAI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2014/09/01
Vol. E97-C  No. 9 ; pp. 867-872
Type of Manuscript:  Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices (IS-EMD2013))
Category: 
Keyword: 
bridgecontact forceseparation speedroot profileCu
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Accurate Modeling Method for Cu Interconnect
Kenta YAMADA Hiroshi KITAHARA Yoshihiko ASAI Hideo SAKAMOTO Norio OKADA Makoto YASUDA Noriaki ODA Michio SAKURAI Masayuki HIROI Toshiyuki TAKEWAKI Sadayuki OHNISHI Manabu IGUCHI Hiroyasu MINDA Mieko SUZUKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/06/01
Vol. E91-C  No. 6 ; pp. 968-977
Type of Manuscript:  PAPER
Category: Semiconductor Materials and Devices
Keyword: 
Cuinterconnectcross-sectionmodeling
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Inlaid Cu Interconnects Employing Ti-Si-N Barrier Metal for ULSI Applications
Tadashi IIJIMA Yoshiaki SHIMOOKA Kyoichi SUGURO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1996/04/25
Vol. E79-C  No. 4 ; pp. 568-572
Type of Manuscript:  PAPER
Category: Semiconductor Materials and Devices
Keyword: 
CuTi-Si-Nbarrierinterconnect
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Significant Decrease in Thickness of Contaminant Films and Contact Resistance by Humidification
Terutaka TAMAI Tetsushi KAWANO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10 ; pp. 1614-1620
Type of Manuscript:  Special Section PAPER (Special Issue on Recent Electromechanical Devices)
Category: Contact Reliability
Keyword: 
humidificationfilm thicknessoxide filmcontact resistanceCu
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