Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2006/03/01
Vol. E89-C
No. 3 ;
pp. 320-326
Type of Manuscript:
Special Section PAPER (Special Section on VLSI Design Technology in the Sub-100 nm Era)
Category: Interface and Interconnect Techniques
Keyword:
inductive coupling, wireless superconnect, 3D-stacked chips, low power, high bandwidth, |
