Keyword : 3D-stacked chips

A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology
Daisuke MIZOGUCHI Noriyuki MIURA Takayasu SAKURAI Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2006/03/01
Vol. E89-C  No. 3 ; pp. 320-326
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design Technology in the Sub-100 nm Era)
Category: Interface and Interconnect Techniques
inductive couplingwireless superconnect3D-stacked chipslow powerhigh bandwidth
 Summary | Full Text:PDF