Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2014/04/01
Vol. E97-C
No. 4 ;
pp. 227-237
Type of Manuscript:
INVITED PAPER (Special Section on Solid-State Circuit Design,---,Architecture, Circuit, Device and Design Methodology)
Category:
Keyword:
silicon, thin-film transistor, 3D-ICs, excimer-laser, crystallization, SRAM, image sensor, flexible electronics, |
