Keyword : 3D-IC


An Efficient Multi-Level Algorithm for 3D-IC TSV Assignment
Cong HAO Takeshi YOSHIMURA 
Publication:   
Publication Date: 2017/03/01
Vol. E100-A  No. 3 ; pp. 776-784
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
3D-ICTSV assignmentmulti commodity flow
 Summary | Full Text:PDF

Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the Power of Interconnections and Pads
Yung-Hao LAI Yang-Lang CHANG Jyh-Perng FANG Lena CHANG Hirokazu KOBAYASHI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2016/06/01
Vol. E99-A  No. 6 ; pp. 1206-1215
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
3D-ICTSVpartitioningarea-overhead reductionpower consumption
 Summary | Full Text:PDF