Keyword : 3D SoC


An Optimization Mechanism for Mid-Bond Testing of TSV-Based 3D SoCs
Kele SHEN Zhigang YU Zhou JIANG 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2016/02/01
Vol. E99-C  No. 2 ; pp. 308-315
Type of Manuscript:  PAPER
Category: Semiconductor Materials and Devices
Keyword: 
core selectiontest timetest costoptimization3D SoC
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