Keyword : 3D ICs


A Region-Based Through-Silicon via Repair Method for Clustered Faults
Tianming NI Huaguo LIANG Mu NIE Xiumin XU Aibin YAN Zhengfeng HUANG 
Publication:   
Publication Date: 2017/12/01
Vol. E100-C  No. 12 ; pp. 1108-1117
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
3D ICsyield enhancementTSV redundancyreparabilityadditional delay overhead
 Summary | Full Text:PDF(1.9MB)

TherWare: Thermal-Aware Placement and Routing Framework for 3D FPGAs with Location-Based Heat Balance
Ya-Shih HUANG Han-Yuan CHANG Juinn-Dar HUANG 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2015/08/01
Vol. E98-A  No. 8 ; pp. 1796-1805
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
thermal-aware placement and routingdesign for qualityfield programmable gate arrays (FPGAs)3D ICs3D FPGAs
 Summary | Full Text:PDF(2.5MB)

Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation
Yuchun MA Xin LI Yu WANG Xianlong HONG 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/12/01
Vol. E92-A  No. 12 ; pp. 2979-2989
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Desing
Keyword: 
3D ICsincremental floorplanningthermalMILP
 Summary | Full Text:PDF(537.2KB)