Keyword : 3D IC

Through-Silicon-Via Characterization and Modeling Using a Novel One-Port De-Embedding Technique
An-Sam PENG Ming-Hsiang CHO Yueh-Hua WANG Meng-Fang WANG David CHEN Lin-Kun WU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2013/10/01
Vol. E96-C  No. 10 ; pp. 1289-1293
Type of Manuscript:  Special Section PAPER (Special Section on Emerging Technologies and Applications for Microwave and Millimeter-Wave Systems)
Category: 
Keyword: 
3D IC, TSV, de-embedding, TEGs, microwave, RF modeling, 
 Summary | Full Text:PDF(1.6MB)
TSV Geometrical Variations and Optimization Metric with Repeaters for 3D IC
Hung Viet NGUYEN Myunghwan RYU Youngmin KIM 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/12/01
Vol. E95-C  No. 12 ; pp. 1864-1871
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
3D IC, TSV (Through Silicon Via), power, delay, optimization, interconnect, repeater, 
 Summary | Full Text:PDF(3.2MB)
Redundant Vias Insertion for Performance Enhancement in 3D ICs
Xu ZHANG Xiaohong JIANG Susumu HORIGUCHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/04/01
Vol. E91-C  No. 4 ; pp. 571-580
Type of Manuscript:  Special Section PAPER (Special Section on Advanced Technologies in Digital LSIs and Memories)
Category: 
Keyword: 
3D IC, redundant vias, via placement, delay, signal integrity, impedance matching, 
 Summary | Full Text:PDF(224.5KB)