Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2013/10/01 Vol. E96-CNo. 10 ;
pp. 1289-1293 Type of Manuscript: Special Section PAPER (Special Section on Emerging Technologies and Applications for Microwave and Millimeter-Wave Systems) Category: Keyword: 3D IC, TSV, de-embedding, TEGs, microwave, RF modeling,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2008/04/01 Vol. E91-CNo. 4 ;
pp. 571-580 Type of Manuscript: Special Section PAPER (Special Section on Advanced Technologies in Digital LSIs and Memories) Category: Keyword: 3D IC, redundant vias, via placement, delay, signal integrity, impedance matching,