Keyword : 3-D IC


Signal Propagation Delay Model in Vertically Stacked Chips
Nanako NIIOKA Masayuki WATANABE Masa-aki FUKASE Masashi IMAI Atsushi KUROKAWA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2015/12/01
Vol. E98-A  No. 12 ; pp. 2614-2624
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Device and Circuit Modeling and Analysis
Keyword: 
3-D ICdelaythrough silicon viasensitivity analysis
 Summary | Full Text:PDF

A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel
Li-Chung HSU Junichiro KADOMOTO So HASEGAWA Atsutake KOSUGE Yasuhiro TAKE Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2015/12/01
Vol. E98-A  No. 12 ; pp. 2584-2591
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Design
Keyword: 
TCIThruChip3-D ICTSVinductive coupling interface
 Summary | Full Text:PDF