C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

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Online ISSN : 1881-0217
Volume J98-C No.11  (Publication Date:2015/11/01)
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Special Section on Technologies of 3D-IC Assembly Which Materialize Advanced Electronic Devices and Leading Assembly Related Materials

pp.224-228  INVITED PAPER  Open Access Paper
Measurement of In-Plane Thermal Conductivity of Printed Circuit Board with Steady State Thermal Conductivity Measurement Method
Tomoyuki HATAKEYAMA  Masaru ISHIZUKA  
Summary | FreeFull Text(in Japanese):PDF(712.7KB)

pp.229-235  INVITED PAPER  Open Access Paper
Solder Bump Fabrication Technology with Molten Solder Injection Method
Kazushige TORIYAMA  Toyohiro AOKI  Hiroyuki MORI  Yasumitsu ORII  
Summary | FreeFull Text(in Japanese):PDF(1.1MB)

pp.236-243  PAPER
Influence of Si-Resistivity on Electrical Properties of TSV and Wiring in Si-IP
Hiroko TASHIRO  Takeshi ISHITSUKA  Seiki SAKUYAMA  
Summary | Full Text(in Japanese):PDF (1.6MB) >>Buy this Article

pp.244-252  PAPER
Structural, Electrical, and Moisture Resistant Properties of Ga, In Co-Doped Zinc Oxide (GZO:In) Films Deposited on Flexible Gas Barrier Substrates
Koichi NAGAMOTO  Tsutomu HARA  Satoshi NAGANAWA  Takeshi KONDO  Hiroshi SAKUMA  Kiyoshi ISHII  
Summary | Full Text(in Japanese):PDF (2.3MB) >>Buy this Article

pp.253-261  PAPER
Process Evaluation of Ultra-Fine Copper Patterns on Printed Circuit Boards Using Test Element Group
Haruki SUEYOSHI  Shigehiro HAYASHI  Kanta NOGITA  Younggun HAN  Osamu HORIUCHI  Hajime TOMOKAGE  
Summary | Full Text(in Japanese):PDF (6.3MB) >>Buy this Article

pp.262-267  PAPER
Method for Mitigating Weave-Induced Skew in PWBs for High-Speed Signal Transmission
Taiga FUKUMORI  Tomoyuki AKAHOSHI  Daisuke MIZUTANI  Motoaki TANI  
Summary | Full Text(in Japanese):PDF (1.2MB) >>Buy this Article

pp.268-275  PAPER
Sample-placement Method of the Non-contact PIM Measurement Using a Coaxial Tube for Single Conductors
Nobuhiro KUGA  
Summary | Full Text(in Japanese):PDF (1MB) >>Buy this Article

pp.276-282  PAPER
Flip Chip Bonding Using High Thermal Conductive Underfill
Kohichiro KAWATE  
Summary | Full Text(in Japanese):PDF (2.3MB) >>Buy this Article

pp.283-285  LETTER
Evaluation of Electrical Property of Conductive Polymer/Metal Composite toward TSV Formation within 10 Minutes
Jin KAWAKITA  Toyohiro CHIKYOW  
Summary | Full Text(in Japanese):PDF (454.7KB) >>Buy this Article

pp.286-288  LETTER
Development of Adhesive Having High Heat Resistance and High Adhesion Force for LED Device
Yutaka NANASHIMA  Hidekazu NAKAYAMA  Mikihiro KASHIO  Shinya TAKYU  Hironori SHIZUHATA  
Summary | Full Text(in Japanese):PDF (570.5KB) >>Buy this Article

Regular Section

pp.289-301  PAPER
Design of Pseudo-Elliptical Wideband Bandpass Filter with Steep Skirt Selectivity Using Parallel-Coupled-Line Structures
Chun-Ping CHEN  Noriki KATO  Junya ODA  Tetsuo ANADA  
Summary | Full Text(in Japanese):PDF (2MB) >>Buy this Article

pp.302-308  PAPER
Preparations and Some Properties of In2O3-Based Thin-Film Transparent Bottom-Electrodes by a Sputtering Method for the Group-III Nitride Photovoltaic Cells
Yuhei MURAKI  Yuichi SATO  
Summary | Full Text(in Japanese):PDF (1MB) >>Buy this Article

pp.309-312  LETTER
Micro-Wall Solar Cell with Electric-Field Effect
Naoto MATSUO  Takahiro KOBAYASHI  Shouta WAKAMIYA  Akira HEYA  
Summary | Full Text(in Japanese):PDF (892.4KB) >>Buy this Article

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