C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

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Online ISSN : 1881-0217
Volume J95-C No.8  (Publication Date:2012/08/01)
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Special Issue on Expectations and Challenges of LSI and High-density Packaging Technology for Heterogeneous Device Integration

pp.148-155  PAPER  Open Access Paper
Microjoining Using Compliant Bump Technology for Heterogeneous Integration
Tanemasa ASANO  
Summary | FreeFull Text(in Japanese):PDF(985.2KB)

pp.156-159  PAPER  Open Access Paper
Ultra-Precision Measurement & Fabrication Technology of LSI and Its Materials for the Next Generation -- Toward the Atomic Scale Production Applying Novel Opt-Mechanical Methods --
Hiroshi KUBOTA  Yuki SOH  Seiya MATSUKAWA  
Summary | FreeFull Text(in Japanese):PDF(618.6KB)

pp.160-163  PAPER  Open Access Paper
A New Data Format FUJIKO for Designing Device Embedded Substrates
Hajime TOMOKAGE  Hidemichi KAWASE  
Summary | FreeFull Text(in Japanese):PDF(626.9KB)

pp.164-174  PAPER  Open Access Paper
Miniaturized Microwave Tunable Filters Based on MEMS-on-LTCC Technology
Xiaoyu MI  Osamu TOYODA  Satoshi UEDA  Fumihiko NAKAZAWA  
Summary | FreeFull Text(in Japanese):PDF(10.1MB)

pp.175-182  PAPER  Open Access Paper
Integrated CMOS-MEMS Technology and Its Applications
Hiroki MORIMURA  Toshishige SHIMAMURA  Kei KUWABARA  Kazuyoshi ONO  Katsuyuki MACHIDA  
Summary | FreeFull Text(in Japanese):PDF(1.8MB)

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