C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

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Online ISSN : 1881-0217
Volume J95-C No.11  (Publication Date:2012/11/01)
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Special Issue on Advanced Material Technological for High-Density Packaging and Hetero Integration

pp.245-253  PAPER  Open Access Paper
Lead-Free Joining Processes for High-Temperature Applications
Akio HIROSE  
Summary | FreeFull Text(in Japanese):PDF(1.4MB)

pp.254-262  PAPER  Open Access Paper
Ceramic Materials and Process Technology for Microelectronics Packaging
Yoshihiko IMANAKA  
Summary | FreeFull Text(in Japanese):PDF(2MB)

pp.263-270  PAPER
New Ceramic Core Build-Up PWB and Flip-Chip Interconnection Technology for High-Density Packaging
Susumu SAWADA  Taiji KUROIWA  Seiji KARASHIMA  Koji KAWAKITA  
Summary | Full Text(in Japanese):PDF (1.4MB) >>Buy this Article

pp.271-278  PAPER
Initial Bondability Evaluation after Cu/Ni Ultrasonic Bonding
Shinichi FUJIWARA  Yo TANAKA  Tomo OGURA  Tomokazu SANO  Akio HIROSE  
Summary | Full Text(in Japanese):PDF (1.4MB) >>Buy this Article

pp.279-286  PAPER
The Evaluation of Flip-Chip Bonding Status with Die Pull Tester
Yoshiyuki ARAI  Yoshinori MIYAMOTO  Shimpei AOKI  Kenichi SHIMATANI  
Summary | Full Text(in Japanese):PDF (1.3MB) >>Buy this Article

pp.287-295  PAPER
Low Temperature Cu-Cu Direct Bonding Method Using Fine Crystallization on Top of Bump Surface
Taiji SAKAI  Nobuhiro IMAIZUMI  Toyoo MIYAJIMA  Shinichi WAKANA  Masataka MIZUKOSHI  
Summary | Full Text(in Japanese):PDF (2.8MB) >>Buy this Article

pp.296-303  PAPER
Hybrid Solder-Adhesive Bonding and Surface Treatment Techniques for 3D LSI
Masatsugu NIMURA  Katsuyuki SAKUMA  Shuichi SHOJI  Jun MIZUNO  
Summary | Full Text(in Japanese):PDF (1.7MB) >>Buy this Article

pp.304-311  PAPER
Study on Fluxless Soldering of Copper Passivated by Self Assembled Monolayer
Akihiro IKEDA  Kiyoaki NAKAHARA  Lijing QIU  Tanemasa ASANO  
Summary | Full Text(in Japanese):PDF (1.5MB) >>Buy this Article

pp.312-316  PAPER
Reliability Improvement of Solder Joints for Power Modules
Junji FUJINO  Junichi MURAI  Goro IZUTA  Nobuhiko OMORI  Yoshihiro KASHIBA  Shinji FUKUMOTO  Kozo FUJIMOTO  
Summary | Full Text(in Japanese):PDF (1.6MB) >>Buy this Article

pp.317-323  PAPER
Effects of Cu-bearing Flux on Microstructure and Joint Reliability of Aged Sn-3.5Ag/Electroless Ni-P/Au Joint
Hitoshi SAKURAI  Youichi KUKIMOTO  Katsuaki SUGANUMA  
Summary | Full Text(in Japanese):PDF (921.4KB) >>Buy this Article

pp.324-332  PAPER
Effect of Ge and P Addition in Sn-Ag-Cu-Ni Lead-Free Solder on the Solder Joint Properties
Ikuo SHOHJI  Hirohiko WATANABE  Ryohei ARAI  
Summary | Full Text(in Japanese):PDF (2MB) >>Buy this Article

pp.333-342  PAPER
Effect of Crystal Orientation on Kink Formation on Mechanically Induced Sn Whiskers
Yukiko MIZUGUCHI  Yosuke MURAKAMI  Shigetaka TOMIYA  Tadashi ASAI  Tomoya KIGA  Katsuaki SUGANUMA  
Summary | Full Text(in Japanese):PDF (4.7MB) >>Buy this Article

pp.343-350  PAPER
Evaluation of Conformal Coating for Mitigation of Whisker Growth
Tsuyoshi NAKAGAWA  Norio NEMOTO  Toshiyuki YAMADA  Katsuaki SUGANUMA  
Summary | Full Text(in Japanese):PDF (1.4MB) >>Buy this Article

pp.351-357  PAPER
Dominant Factors of the Stress-Induced Migration in Electroplated Copper Thin-Film Interconnections
Naoki SAITO  Naokazu MURATA  Kinji TAMAKAWA  Ken SUZUKI  Hideo MIURA  
Summary | Full Text(in Japanese):PDF (1.6MB) >>Buy this Article

pp.358-364  PAPER
Visco-Elastic Behavior and Low-Cycle Fatigue Life Analysis of Ag-Epoxy Isotropic Conductive Adhesive
Yoshiharu KARIYA  Hiromitsu FURUSAWA  Yoshihiko KANDA  
Summary | Full Text(in Japanese):PDF (811.1KB) >>Buy this Article

pp.365-371  PAPER
An Experimental Study of Digital High Frequency Electrical Property for Printing Wiring and Bump Connection of the Electrical Conductive Adhesive with Ag Particles
Yutaka AKIYAMA  Kazuo KOHNO  Kanji OTSUKA  
Summary | Full Text(in Japanese):PDF (3MB) >>Buy this Article

pp.372-380  PAPER
An Improvement of Sensitivity for Passive Intermodulation Measurement of a PCB Using the Standing Wave Coaxial Tube Method
Daijiro ISHIBASHI  Keita HOSHINO  Kensuke SAITO  Nobuhiro KUGA  
Summary | Full Text(in Japanese):PDF (1.7MB) >>Buy this Article

pp.381-386  PAPER
300 Gbit/s Data Transmission Realized by Low-Loss Polynorbornene Waveguide
Shinsuke TERADA  Yuka ITO  Akihiro HORIMOTO  Satoru KATSURAYAMA  Koji CHOKI  
Summary | Full Text(in Japanese):PDF (1MB) >>Buy this Article

pp.387-393  PAPER
Fine-Pitch Smooth Wiring Technology Using Adhesion Promoter Transfer Method
Motoaki TANI  Shinya SASAKI  Keisuke UENISHI  
Summary | Full Text(in Japanese):PDF (1.9MB) >>Buy this Article

pp.394-399  PAPER
Low Temperature Wiring Technology with Silver β-Ketocarboxylate
Kumi HIROSE  Mitsuru KAWAZOME  Takuya SEKIGUCHI  Mariko HATAMURA  Katsuaki SUGANUMA  
Summary | Full Text(in Japanese):PDF (1.1MB) >>Buy this Article

pp.400-407  PAPER
Quantification of EMI Reducing Techniques by Applying a Lossless Vertically Differential Method
Ayako TAKAGI  Haruhiko OKUMURA  Hisashi SASAKI  
Summary | Full Text(in Japanese):PDF (1.3MB) >>Buy this Article

pp.408-417  PAPER
Health Monitoring Method for Semiconductor Packaging Modules Subjected to Random Dynamic Load
Yousuke HISAKUNI  Takahiro OMORI  Kenji HIROHATA  
Summary | Full Text(in Japanese):PDF (2.1MB) >>Buy this Article

pp.418-426  PAPER
Development of Compact Loop-Heat-Pipe System for Electronic Devices
Tomonao TAKAMATSU  Katsumi HISANO  Kenji HIROHATA  
Summary | Full Text(in Japanese):PDF (2.3MB) >>Buy this Article

pp.427-433  PAPER
Thermal Design of PCB Using CFD Analysis with Effective Thermal Conductivity
Tomoyuki HATAKEYAMA  Risako KIBUSHI  Masaru ISHIZUKA  
Summary | Full Text(in Japanese):PDF (1.8MB) >>Buy this Article

pp.434-438  PAPER
Improvement in Thermal Conductivity of Composite Material Filled with BN Filler
Kenji MIMURA  Motoki MASAKI  Yurie NAKAMURA  Takashi NISHIMURA  
Summary | Full Text(in Japanese):PDF (651.5KB) >>Buy this Article

pp.439-446  PAPER
A Novel Temporary Bonding and Debonding Technology for TSV Fabrication and 3D Integration
Masaya KAWANO  Takumi KOMATSU  Jürgen BURGGRAF  Daniel BURGSTALLER  Thorsten MATTHIAS  Markus WIMPLINGER  Paul LINDNER  
Summary | Full Text(in Japanese):PDF (4.4MB) >>Buy this Article

pp.447-454  PAPER
High Thermal Resistant Polyimide Adhesives and Thinned Wafer Handling for 3D-Packaging Technology
Masashi KOTANI  Melvin P. ZUSSMAN  Toshiaki ITABASHI  
Summary | Full Text(in Japanese):PDF (1.3MB) >>Buy this Article

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