C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

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Online ISSN : 1881-0217
Volume J94-C No.11  (Publication Date:2011/11/01)
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Special Issue on High-speed & High-density Packaging and Integration Technologies for Microelectronic Devices

pp.355-364  PAPER  Open Access Paper
3D Integration Technology and Heterogeneous Integration
Mitsumasa KOYANAGI  Takafumi FUKUSHIMA  Kangwook LEE  Tetsu TANAKA  
Summary | FreeFull Text(in Japanese):PDF(3.3MB)

pp.365-371  PAPER  Open Access Paper
Emergency Issue of Concurrent Design for High Speed LSI and Packaging
Kanji OTSUKA  
Summary | FreeFull Text(in Japanese):PDF(1MB)

pp.372-379  PAPER  Open Access Paper
High Speed and High Accuracy Flip-Chip Bonding Technology Using Microbumps
Katsumi TERADA  Mikio KAWAKAMI  
Summary | FreeFull Text(in Japanese):PDF(1.8MB)

pp.380-385  PAPER
Advanced Trench Filling Process by Selective Copper Electrodeposition for Ultra Fine Printed Wiring Board Fabrication
Hiroshi NAKANO  Hitoshi SUZUKI  Toshio HABA  Hiroshi YOSHIDA  Akira CHINDA  Haruo AKAHOSHI  
Summary | Full Text(in Japanese):PDF (634.1KB) >>Buy this Article

pp.386-393  PAPER
Electroless Barrier/Seed Plating for Cu-TSV Using Au Nanoparticles
Fumihiro INOUE  Tomohiro SHIMIZU  Kazuo KONDO  Taro HAYASHI  Shoso SHINGUBARA  
Summary | Full Text(in Japanese):PDF (2.2MB) >>Buy this Article

pp.394-401  PAPER
High Density Cu/Sn Microbump Formation Using EEB (Electroplating and Evaporation Bumping) Technology for High Performance Three Dimensional Integration
Yuki OHARA  Akihiro NORIKI  Kang-Wook LEE  Takafumi FUKUSHIMA  Tetsu TANAKA  Mitsumasa KOYANAGI  
Summary | Full Text(in Japanese):PDF (1.4MB) >>Buy this Article

pp.402-410  PAPER
Reliability of Microbumps Interconnect for 3D TSV Chip Stacking
Yasumitsu ORII  Katsuyuki SAKUMA  Kuniaki SUEOKA  Sayuri KOHARA  Kazushige TORIYAMA  Keiji MATSUMOTO  Hirokazu NOMA  Keishi OKAMOTO  Toyohiro AOKI  
Summary | Full Text(in Japanese):PDF (1.9MB) >>Buy this Article

pp.411-418  PAPER
Impacts of Bending Stress on MOSFET Characteristics by LSI Stacking for 3D-LSI
Hisashi KINO  Mariappan MURUGESAN  Toshiya KOJIMA  Takafumi FUKUSHIMA  Tetsu TANAKA  Mitsumasa KOYANAGI  
Summary | Full Text(in Japanese):PDF (1.7MB) >>Buy this Article

pp.419-426  PAPER
Study of Stress to Solder Joint by Underfill Filling
Akira TANAKA  Akihiko HAPPOYA  Shun OKAYAMA  
Summary | Full Text(in Japanese):PDF (1.7MB) >>Buy this Article

pp.427-432  PAPER
Hermetic Sealing Technology for Micro-Devices Using Printing of No-Clean Lead-Free Solder Paste and Reflow with Hydrogen-Radical Treatment
Hiroki OSHIKAWA  Shinichi YAMAMOTO  Eiji HIGURASHI  Tadatomo SUGA  Sakie OKADA  
Summary | Full Text(in Japanese):PDF (631.5KB) >>Buy this Article

pp.433-440  PAPER
Micro Mirror Arrays for Improved Sensitivity of Thermopile Infrared Sensors
Makoto OHIRA  Makoto MORIGUCHI  Sho SASAKI  Masatoshi OBA  Tomoyuki TAKAHATA  Isao SHIMOYAMA  Masafumi KIMATA  
Summary | Full Text(in Japanese):PDF (1.3MB) >>Buy this Article

pp.441-447  PAPER
Applications of Si Microchannel Cooler to High Power Amplifiers for Base Station of Mobile Communication Systems
Yoshihiro MIZUNO  Ikuo SOGA  Shinichi HIROSE  Osamu TSUBOI  Taisuke IWAI  
Summary | Full Text(in Japanese):PDF (1.1MB) >>Buy this Article

pp.448-457  PAPER
Detecting Noise Sources with Time Series Analysis
Akira SHOJIGUCHI  Manabu KUSUMOTO  Takashi HARADA  
Summary | Full Text(in Japanese):PDF (1.7MB) >>Buy this Article

pp.458-469  PAPER
A Method of Extracting an EMC Macro-Model LECCS-Core from a Time-Variant Linear Equivalent Circuit of a CMOS LSI
Hiroshi TANAKA  Tohlu MATSUSHIMA  Takashi HISAKADO  Osami WADA  
Summary | Full Text(in Japanese):PDF (1.1MB) >>Buy this Article

pp.470-471  LETTER
Low-Temperature Bonding of Laser Diode Chips Using Au Stud Bumps
Takeshi SATO  Eiji HIGURASHI  Tadatomo SUGA  Renshi SAWADA  
Summary | Full Text(in Japanese):PDF (560.7KB) >>Buy this Article

pp.472-475  LETTER
3D Module Structure and Laser Diode Driver with Mutually Coupled Inductors for 20 Gbit/s Optical Transmitter Module
Toshiaki TAKAI  Norio CHUJO  Saori HAMAMURA  Daichi KAWAMURA  Yasunobu MATSUOKA  Kouichirou ADACHI  Toshiki SUGAWARA  Tsuneo KAWAMATA  Toshinobu OHNO  Kenichi OHHATA  
Summary | Full Text(in Japanese):PDF (1MB) >>Buy this Article

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