C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

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Online ISSN : 1881-0217
Volume J93-C No.11  (Publication Date:2010/11/01)
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Special Section on Advanced Packaging and Its Related Topics about Evaluation and Analysis Technologies for High-Density Packaging

pp.383-387  PAPER  Open Access Paper
Development of Highly Functional Bioplastics (Polylactic Acid Composite) Used for Electronic Products
Masatoshi IJI  
Summary | FreeFull Text(in Japanese):PDF(1.2MB)

pp.388-398  PAPER  Open Access Paper
High Resolution Electrical Measurement Technology for Fine Structures in 3D LSI Chip Stacking Integration Technology
Masahiro AOYAGI  Katsuya KIKUCHI  Motohiro SUZUKI  Hiroshi NAKAGAWA  
Summary | FreeFull Text(in Japanese):PDF(2.1MB)

pp.399-405  PAPER  Open Access Paper
Printed Electronics and Its Materials Technology
Katsuaki SUGANUMA  Masaya NOGI  
Summary | FreeFull Text(in Japanese):PDF(950.4KB)

pp.406-413  PAPER
Fast Transient Simulation of Plane Distribution Network by Using GPGPU-LIM
Yuta INOUE  Tadatoshi SEKINE  Hideki ASAI  
Summary | Full Text(in Japanese):PDF (648KB) >>Buy this Article

pp.414-423  PAPER
Evaluation of Electrical Characteristics for a High-Pin-Count and Thin Embedded LSI Chip Package
Daisuke OHSHIMA  Kentaro MORI  Yoshiki NAKASHIMA  Hideki SASAKI  Katsumi KIKUCHI  Shintaro YAMAMICHI  
Summary | Full Text(in Japanese):PDF (2MB) >>Buy this Article

pp.424-432  PAPER
Micro-Noise Design/Verification Technique Development of Chip-Package-Board for Mixed-Signal Systems
Mikiko SODE TANAKA  Osamu TAKEUCHI  Hayato OGAWA  Hideki SASAKI  Hiroyuki UCHIDA  Mituhiro ONO  
Summary | Full Text(in Japanese):PDF (2.3MB) >>Buy this Article

pp.433-444  PAPER
A Combined IC Macro Model of IBIS and LECCS-Core Models for PI/SI Analyses
Norimasa OKA  Kengo IOKIBE  Yoshitaka TOYOTA  Ryuji KOGA  
Summary | Full Text(in Japanese):PDF (1.7MB) >>Buy this Article

pp.445-454  PAPER
Power Supply Current Analysis of 8-bit Micro-Controller with Considering Program Dependency
Yoshiyuki SAITO  Katsuya NOMURA  Masakatsu YASUHARA  Osami WADA  
Summary | Full Text(in Japanese):PDF (1.3MB) >>Buy this Article

pp.455-463  PAPER
Proposal of Hybrid FPC for 3D-SiP Package
Kikuo WADA  Ryouji OHSU  Shigekazu HINO  Nobuyuki YAMASAKI  
Summary | Full Text(in Japanese):PDF (1.1MB) >>Buy this Article

pp.464-476  PAPER
3D Large Scale Integration Technology Using Wafer-on-Wafer (WOW) Stacking
Takayuki OHBA  Nobuhide MAEDA  Hideki KITADA  Koji FUJIMOTO  Akihito KAWAI  Kazuhisa ARAI  Kosuke SUZUKI  Tomoji NAKAMURA  
Summary | Full Text(in Japanese):PDF (3.7MB) >>Buy this Article

pp.477-484  PAPER
Development of High-Frequency Inductors Using Wafer-Level Packaging Technology and Its Circuit Application
Hideki HATAKEYAMA  Yusuke UEMICHI  Shuhei AMAKAWA  Noboru ISHIHARA  Kazuya MASU  
Summary | Full Text(in Japanese):PDF (769.7KB) >>Buy this Article

pp.485-492  PAPER
Microstructure and Mechanical Properties of Sb Addition Eutectic Sn-Bi Solder
Seiki SAKUYAMA  Toshiya AKAMATSU  Keisuke UENISHI  Takehiko SATO  
Summary | Full Text(in Japanese):PDF (1.9MB) >>Buy this Article

pp.493-502  PAPER
High-Precision Chip Alignment Using Self-Assembly Technology for Three-Dimensional Integrated Circuit Applications
Eiji IWATA  Takafumi FUKUSHIMA  Yuki OHRA  Kang-wook LEE  Tetsu TANAKA  Mitsumasa KOYANAGI  
Summary | Full Text(in Japanese):PDF (2.9MB) >>Buy this Article

pp.503-508  PAPER
Novel MEMS Packaging Technology with Combining STP and Screen-Print Techniques
Naruto MAYUMI  Mitsuru CHINO  Hiroshi TAZAWA  Toshikazu KAMEI  Katsuyuki MACHIDA  Eiji HIGURASHI  
Summary | Full Text(in Japanese):PDF (512.2KB) >>Buy this Article

pp.509-515  PAPER
Sealing Evaluation of Microdevices Using Resonance Charactaricstics of Cantilevers Vibrated Photothermally
Shin-ichi YAMAMOTO  Eiji HIGURASHI  Tadatomo SUGA  Renshi SAWADA  
Summary | Full Text(in Japanese):PDF (675.7KB) >>Buy this Article

pp.516-520  PAPER
Validation of Multiple Power-Supply-Pin LECCS-core Model for Conducted RF Power Current Simulation
Kengo IOKIBE  Ryota HIGASHI  Takahiro TSUDA  Kouji ICHIKAWA  Katsumi NAKAMURA  Yoshitaka TOYOTA  Ryuji KOGA  
Summary | Full Text(in Japanese):PDF (1.2MB) >>Buy this Article

pp.521-523  PAPER
High-Density (480-Gbit/s/cm2) Optical Printed Circuit Board with an Efficient Optical Interface
Yasunobu MATSUOKA  Norio CYUJYO  Yong LEE  Tomoaki SHIBATA  Toshiki SUGAWARA  
Summary | Full Text(in Japanese):PDF (499.6KB) >>Buy this Article

pp.524-526  PAPER
Formation of Fine Wiring Pattern with Laser Assited Ink-Jet Printing
Akito ENDO  Jun AKEDO  
Summary | Full Text(in Japanese):PDF (1.3MB) >>Buy this Article

Regular Section

pp.527-532  PAPER
High-Power Pico-Second Vortex Output from a Stressed Large-Mode Area Fiber Amplifier
Yuichi TANAKA  Mio KOYAMA  Masahito OKIDA  Katsuhiko MIYAMOTO  Takashige OMATSU  
Summary | Full Text(in Japanese):PDF (618.9KB) >>Buy this Article

pp.533-534  LETTER
A Basic Study of a Diplexer Using a Wide-Band LTCC Filter with Attenuation Poles and a SAW Filter
Tatsuya KATSUMOTO  Shinpei OSHIMA  Ryuji MURATA  Hitoshi EBIHARA  Kouji WADA  
Summary | Full Text(in Japanese):PDF (534.9KB) >>Buy this Article

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