C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

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Online ISSN : 1881-0217
Volume J92-C No.11  (Publication Date:2009/11/01)
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Special Issue on Advanced Packging and Environmentally Conscious Packaging Technologies in Next-Generation Electronic Equipment

pp.581-594  PAPER  Open Access Paper
Future Direction of Solid State Micro-Joining Applied to Environmentally Friendly Electronic Packaging
Yasuo TAKAHASHI  
Summary | FreeFull Text(in Japanese):PDF(3.1MB)

pp.595-605  PAPER  Open Access Paper
Trends and Future Technology Direction of Wafer Level Chip Scale Packages
Hiroshi YAMADA  
Summary | FreeFull Text(in Japanese):PDF(2.1MB)

pp.606-612  PAPER
Consideration of Tin Whisker Growth Mechanism for Lead-Free Plating
Seiki SAKUYAMA  Michinori KUTAMI  
Summary | Full Text(in Japanese):PDF (1.1MB) >>Buy this Article

pp.613-621  PAPER
Mechanical Reliability of Cu/low-k On-Chip Interconnect in FCBGA
Chihiro J. UCHIBORI  Michael LEE  Xeufeng ZANG  Paul S. HO  
Summary | Full Text(in Japanese):PDF (1.3MB) >>Buy this Article

pp.622-631  PAPER
Health-Monitoring for Electronic Assembly Board of Digital Products -- Monitoring Method for Assessment of Field Load and Thermal Performance Degradation --
Kenji HIROHATA  Katsumi HISANO  Minoru MUKAI  
Summary | Full Text(in Japanese):PDF (1.8MB) >>Buy this Article

pp.632-639  PAPER
Bonding Technology of Micro-Components on Wafer for MEMS Device of Layer Stack Structure Using Manipulator
Hiroyuki MOTOHARA  Mikio NAKAMURA  
Summary | Full Text(in Japanese):PDF (1.1MB) >>Buy this Article

pp.640-645  PAPER
Properties of Insulator Using O3-TEOS CVD for MEMS TSV Electrodes
Akinobu KANAI  Makoto MORIGUCHI  Sho SASAKI  Masatoshi OBA  
Summary | Full Text(in Japanese):PDF (537.5KB) >>Buy this Article

pp.646-654  PAPER
Practical Use of 3D Stacking Technology Using Direct Connection between TSV and Bump
Nobuaki MIYAKAWA  Eiri HASHIMOTO  Takanori MAEBASHI  Natsuo NAKAMURA  Yutaka SACHO  Shigeto NAKAYAMA  Shinjiro TOYODA  
Summary | Full Text(in Japanese):PDF (7.8MB) >>Buy this Article

pp.655-663  PAPER
Embedded Decoupling Capacitors Technology for Si Interposer Applications
Takeshi SHIOGA  John D. BANIECKI  Masatoshi ISHII  Kazuaki KURIHARA  Yoshikatsu ISHIZUKI  Masataka MIZUKOSHI  
Summary | Full Text(in Japanese):PDF (1.6MB) >>Buy this Article

pp.664-670  PAPER
IC Embedded Polyimide Multilayer Wiring Boards Utilizing Wafer Level Packaging Technology
Satoshi OKUDE  Masahiro OKAMOTO  Takanao SUZUKI  Osamu NAKAO  
Summary | Full Text(in Japanese):PDF (1.5MB) >>Buy this Article

pp.671-679  PAPER
Wafer Level CSP Technology and Application to Embedded Inductor
Yutaka AOKI  Osamu OKADA  Osamu KUWABARA  Tomoyuki KOSUGI  Syoichi KOTANI  Kazuhiro MASUDA  Ichiro MIHARA  Takeshi WAKABAYASHI  
Summary | Full Text(in Japanese):PDF (2MB) >>Buy this Article

pp.680-687  PAPER
Semiconductor Package for 43 Gbit/s Transmission with Thin Transmission Line Lead
Hiroshi KIKUCHI  Norio NAKAZATO  Naotaka TANAKA  Satoru ISOMURA  
Summary | Full Text(in Japanese):PDF (1.6MB) >>Buy this Article

pp.688-694  PAPER
Basic Study on System Design Method for Proper System LSI Packaging in Mobile Phone
Yoshiharu IWATA  Atsushi TAYA  Ryohei SATOH  Kazuya OKAMOTO  Keiji KUDO  
Summary | Full Text(in Japanese):PDF (1.1MB) >>Buy this Article

pp.695-702  PAPER
Design Solution Improvement for Electrical-Thermal Collaborated Design by Using Multi-Agent Theory -- Outline Layout Design Automation by Collaboration between Thermal Layout and Circuit Layout --
Yoshiharu IWATA  Shintaro HAYASHI  Ryohei SATOH  Kozo FUJIMOTO  
Summary | Full Text(in Japanese):PDF (791.2KB) >>Buy this Article

pp.703-711  PAPER
Development of Full-Stacked Via Printed Wiring Board with High Thermal Reliability
Akihiko HAPPOYA  Akira TANAKA  Kenji HIROHATA  Shun OKAYAMA  
Summary | Full Text(in Japanese):PDF (1.7MB) >>Buy this Article

pp.712-721  PAPER
Burn-In Test Chip-Carrier for LSI Chips with Micro Pad Pitch
Motohiro SUZUKI  Tokihiko YOKOSHIMA  Yoshikuni OKADA  Hiroshi NAKAGAWA  Masahiro AOYAGI  Masatoshi MIURA  Tsuyoshi TAKAHASHI  Kimiya KITAYAMA  Atsushi ETOU  Tomohiro HIMENO  Akira MARUI  
Summary | Full Text(in Japanese):PDF (1.5MB) >>Buy this Article

Regular Section

pp.722-730  PAPER
Design of Thermo-Tunable Couplers Based on Solid-Core Photonic Band-Gap Fibers
Ryuichi YOSHIDA  Yukihiro TSUCHIDA  Tadashi MURAO  Kunimasa SAITOH  Masanori KOSHIBA  
Summary | Full Text(in Japanese):PDF (1.8MB) >>Buy this Article

pp.731-741  PAPER
Analysis of Stripline Right-Angle Bend with Square-Shaped Corner Cut and Discussion on the Optimum Cut Based on Planar Circuit Model and Foster-Type Equivalent Network
Takaharu HIRAOKA  Jui-pang HSU  
Summary | Full Text(in Japanese):PDF (1.8MB) >>Buy this Article

pp.742-743  LETTER
Proposal of a FinFET Type DTMOS
Yu HIROSHIMA  Shigeyoshi WATANABE  
Summary | Full Text(in Japanese):PDF (262.1KB) >>Buy this Article

pp.745-749  LETTER
Phase Noise Estimation for the ORIGAMI Oscillator
Takeshi SHIMA  Takashi KUSAGA  
Summary | Full Text(in Japanese):PDF (271.2KB) >>Buy this Article

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