C - Abstracts of IEICE TRANSACTIONS on Electronics (Japanese Edition)

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Online ISSN : 1881-0217
Volume J91-C No.11  (Publication Date:2008/11/01)
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Special Issue on Leading-Edge Trend of Advanced Packages for Electron Devices and Its Related Topics for High-Density Packaging Process Technologies

pp.509-518  PAPER
Current Barriers and Future Direction of Semiconductor Packaging with Flip Chip Bonding
Yutaka TSUKADA  Kimihiro YAMANAKA  Takayuki NEJIME  
Summary | Full Text(in Japanese):PDF (1.2MB) >>Buy this Article

pp.519-526  PAPER
Cu Bumpless Interconnect by SAB at Room Temperature and 3D Integration
Todatomo SUGA  
Summary | Full Text(in Japanese):PDF (3.3MB) >>Buy this Article

pp.527-533  PAPER
Wafer Level Packaging of MEMS
Masayoshi ESASHI  
Summary | Full Text(in Japanese):PDF (923.1KB) >>Buy this Article

pp.534-541  PAPER
Low Temperature Sn-Bi Soldering Tecnology for Low Stress Packaging
Seiki SAKUYAMA  Toshiya AKAMATSU  Keisuke UENISHI  Takehiko SATO  
Summary | Full Text(in Japanese):PDF (1.4MB) >>Buy this Article

pp.542-551  PAPER
Through-Silicon Via Interconnection for 3D Integration Using Room-Temperature Bonding
Naotaka TANAKA  Yasuhiro YOSHIMURA  Michihiro KAWASHITA  Takahiro NAITO  Toshihide UEMATSU  Chuichi MIYAZAKI  Norihisa TOMA  Kenji HANADA  Masaki NAKANISHI  Takafumi KIKUCHI  Takashi AKAZAWA  
Summary | Full Text(in Japanese):PDF (2.4MB) >>Buy this Article

pp.552-558  PAPER
Signal-to-Noise Ratio Measurements of Mixed-Signal System-in-Package (SiP)
Hideki SASAKI  Yuki FUJIMURA  Tomoo MURAKAMI  Hiroyuki TERAI  
Summary | Full Text(in Japanese):PDF (878KB) >>Buy this Article

pp.559-568  PAPER
High Accuracy Modeling Method for High Density and Multi-Functional Packages
Toru YAMADA  Masahiro YAMAOKA  Kazuhide URIU  Ken-ya HASHIMOTO  Masatsune YAMAGUCHI  
Summary | Full Text(in Japanese):PDF (1.9MB) >>Buy this Article

pp.569-576  PAPER
Evaluation of an Interposer Embedded Capacitors for a System LSI
Yoshiyuki SAITO  Eiji TAKAHASHI  Chie SASAKI  Yasuhiro SUGAYA  
Summary | Full Text(in Japanese):PDF (1014.6KB) >>Buy this Article

pp.577-585  PAPER
Productivity and Reliability of Module Using Substrate with Cavity
Akihiko HAPPOYA  Jun KARASAWA  Daigo SUZUKI  Koji SHINGUU  Kenji HIROHATA  Shun OKAYAMA  
Summary | Full Text(in Japanese):PDF (1.4MB) >>Buy this Article

pp.586-594  PAPER
High-Density Integration of Dissimilar Materials by Epifilm Bonding Technology
Mitsuhiko OGIHARA  Hiroyuki FUJIWARA  Takahito SUZUKI  Tomoki IGARI  Seiji MORISAKI  Masaaki SAKUTA  
Summary | Full Text(in Japanese):PDF (1.1MB) >>Buy this Article

pp.595-602  PAPER
Pressureless Flip-Chip Bonding Method Using Electroless Plating
Yasuhiro YAMAJI  Tokihiko YOKOSHIMA  Noboru IGAWA  Yuichiro TAMURA  Katsuya KIKUCHI  Hiroshi NAKAGAWA  Masahiro AOYAGI  
Summary | Full Text(in Japanese):PDF (2.1MB) >>Buy this Article

pp.603-609  PAPER
Novel Dicing Technologies for Thin Chips Realizing High Chip Strength
Shinya TAKYU  Tetsuya KUROSAWA  Noriko SHIMIZU  Susumu HARADA  
Summary | Full Text(in Japanese):PDF (485.5KB) >>Buy this Article

pp.610-616  PAPER
Development of Optical Integrated Chip Using Si Microlens
Ryo SEKIKAWA  Daisuke SHIMURA  Masahiro UEKAWA  Hironori SASAKI  Kazutoshi KOMATSU  Teijiro ORI  
Summary | Full Text(in Japanese):PDF (1.8MB) >>Buy this Article

pp.617-626  PAPER
High-Density Mounting of Piezoresistive Pressure Sensors Using Reticle Free Exposure Method for Suppressing Fluctuation of Sensitivity
Yuki SOH  Naoki HAYASHI  Taishi ENDO  Katsuhiko WAKASUGI  Takeshi ICHIKAWA  Shigeyuki MATSUMOTO  Hiroshi KUBOTA  
Summary | Full Text(in Japanese):PDF (925.1KB) >>Buy this Article

pp.627-634  PAPER
Real-Time Observation of Lead-Free Solder Reflow Process Using Hydrogen Plasma and Determination of Reflow Profile
Eiji HIGURASHI  Shuichi NISHI  Tadatomo SUGA  Taizoh HAGIHARA  Tatsuya TAKEUCHI  Sakie YAMAGATA  Rikiya KATO  
Summary | Full Text(in Japanese):PDF (1.2MB) >>Buy this Article

pp.635-644  PAPER
Quality Improvement of GaAs Chips Die-Bonding Using AuSn Solder with Interface Reaction Control
Junji FUJINO  Masayasu ITO  Hiroo SAKAMOTO  Akiyoshi SAWAI  Kozo FUJIMOTO  
Summary | Full Text(in Japanese):PDF (1.8MB) >>Buy this Article

pp.645-651  PAPER
Improvement of the Maximum Heat Flux by Applying Zeotropic Coolant Mixtures
Kishio YOKOUCHI  Keisuke UENISHI  Takehiko SATO  
Summary | Full Text(in Japanese):PDF (597.9KB) >>Buy this Article

Regular Section

pp.652-657  PAPER
Miniaturization of Broadband Branch-Line Couplers by Using Divided-Transmission Lines
Fumio TAKEDA  
Summary | Full Text(in Japanese):PDF (542.4KB) >>Buy this Article

pp.658-665  PAPER
4-12 GHz Cryogenic Low-Noise HEMT Amplifier
Takafumi KOJIMA  Yasuhiro ABE  Hideo OGAWA  
Summary | Full Text(in Japanese):PDF (647KB) >>Buy this Article

pp.666-667  LETTER
Study for Reading Method of Stacked NAND Type MRAM Using Spin Transistor
Shoto TAMAI  Shigeyoshi WATANABE  
Summary | Full Text(in Japanese):PDF (145.6KB) >>Buy this Article

pp.668-669  LETTER
Reading Method of NAND Type 1-Transistor FeRAM with Pulse Input
Koichi SUGANO  Shigeyoshi WATANABE  
Summary | Full Text(in Japanese):PDF (355.2KB) >>Buy this Article

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