IEICE Trans

IEICE TRANSACTIONS on Electronics

Volume E82-C No.3 (Publication Date:1999/03/25)

Special Issue on Ultra-High-Speed IC and LSI Technology

pp.407-408 FOREWORD FOREWORD Junko AKAGI
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pp.409-418 INVITED PAPER Ultrahigh-Speed IC Technologies Using InP-Based HEMTs for Future Optical Communication Systems Yohtaro UMEDA Takatomo ENOKI Taiichi OTSUJI Tetsuya SUEMITSU Haruki YOKOYAMA Yasunobu ISHII
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pp.419-427 INVITED PAPER High Performance InP/InGaAs HBTs for 40-Gb/s Optical Transmission ICs Hiroshi MASUDA Kiyoshi OUCHI Akihisa TERANO Hideyuki SUZUKI Koichi WATANABE Tohru OKA Hirokazu MATSUBARA Tomonori TANOUE
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pp.428-437 INVITED PAPER Design Innovations for Multi-Gigahertz-Rate Communication Circuits with Deep-Submicron CMOS Technology Masakazu KURISU Muneo FUKAISHI Hiroshi ASAZAWA Masato NISHIKAWA Kazuyuki NAKAMURA Michio YOTSUYANAGI
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pp.438-447 INVITED PAPER Interface Technologies for Memories and ASICs -- Review and Future Direction -- Yasuhiro KONISHI Yasunobu NAKASE Katsushi ASAHINA Makoto TANIGUCHI Michihiro YAMADA
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pp.448-455 PAPER-Compound Semiconductor Devices AlGaAs/InGaAs HBT IC Modules for 40-Gb/s Optical Receiver Risato OHHIRA Yasushi AMAMIYA Takaki NIWA Nobuo NAGANO Takeshi TAKEUCHI Chiharu KURIOKA Tomohiro CHUZENJI Kiyoshi FUKUCHI
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pp.456-464 PAPER-Compound Semiconductor Devices Exclusive OR/NOR IC for 40-Gbit/s Clock Recovery Circuit Koichi MURATA Taiichi OTSUJI Takatomo ENOKI Yohtaro UMEDA Mikio YONEYAMA
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pp.465-474 PAPER-Compound Semiconductor Devices AlGaAs/GaAs HBT ICs for 20-Gb/s Optical Transmission Systems Nobuo NAGANO Masaaki SODA Hiroshi TEZUKA Tetsuyuki SUZAKI Kazuhiko HONJO
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pp.475-482 PAPER-Compound Semiconductor Devices Ultra-High-Speed GaAs MESFET IC Modules Using Flip Chip Bonding Hiroyuki KIKUCHI Hideki TSUNETSUGU Makoto HIRANO Satoshi YAMAGUCHI Yuhki IMAI
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pp.483-490 PAPER-Compound Semiconductor Devices 5 Gsps Oversampling Analog-to-Digital Converters with Polarity Alternating Feedback Comparator Takumi MIYASHITA Alfredo OLMOS Mizuhisa NIHEI Yuu WATANABE
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pp.491-497 PAPER-Compound Semiconductor Devices 0.21-fJ GaAs DCFL Circuits Using 0.2-µm Y-Shaped Gate AlGaAs/InGaAs E/D-HJFETs Shigeki WADA Masatoshi TOKUSHIMA Masaoki ISHIKAWA Nobuhide YOSHIDA Masahiro FUJII Tadashi MAEDA
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pp.498-503 PAPER-Silicon Devices 2.5 Gb/s 1:8 DEMUX IC Composed of 0.15 µm Single-Gate CMOS Toshiyuki OCHIAI Hideaki MATSUHASHI Hiroshi HOGA Satoshi NISHIKAWA
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pp.504-510 PAPER-Silicon Devices A Flip-Flop Circuit with a Directly Controlled Emitter-Follower and a Level Stabilizer for Low-Power Prescalers Hisayasu SATO Nagisa SASAKI Takahiro MIKI
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pp.511-518 PAPER-Silicon Devices Low-Power 2.5-Gb/s Si-Bipolar IC Chipset for Optical Receivers and Transmitters Using Low-Voltage and Adjustment-Free Circuit Techniques Masaki HIROSE Keiji KISHINE Haruhiko ICHINO Noboru ISHIHARA
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pp.519-525 PAPER-Silicon Devices A Dynamic Reference Single-Ended ECL Input Interface Circuit for MCM-Based 80-Gbps ATM Switch Ryusuke KAWANO Naoaki YAMANAKA Eiji OKI Tomoaki KAWAMURA
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pp.526-530 PAPER-Silicon Devices Self-Aligned SiGe HBTs with Doping Level Inversion Using Selective Epitaxy Shuji ITO Toshiyuki NAKAMURA Hiroshi HOGA Satoshi NISHIKAWA Hirokazu FUJIMAKI Yumiko HIJIKATA Yoshihisa OKITA
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pp.531-537 PAPER-Silicon Devices An FET Coupled Logic (FCL) Circuit for Multi-Gb/s, Low Power and Low Voltage Serial Interface BiCMOS LSIs Hitoshi OKAMURA Masaharu SATO Satoshi NAKAMURA Shuji KISHI Kunio KOKUBU
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pp.538-543 PAPER-Silicon Devices High Frequency Characteristics of Dynamic Threshold-Voltage MOSFET (DTMOS) under Ultra-Low Supply Voltage Tetsu TANAKA Youichi MOMIYAMA Toshihiro SUGII
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pp.544-552 PAPER-Silicon Devices Analysis and Optimization of Floating Body Cell Operation for High-Speed SOI-DRAM Fukashi MORISHITA Yasuo YAMAGUCHI Takahisa EIMORI Toshiyuki OASHI Kazutami ARIMOTO Yasuo INOUE Tadashi NISHIMURA Michihiro YAMADA
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pp.553-558 PAPER-Silicon Devices Low dc Power Si-MOSFET L- and C-Band Low Noise Amplifiers Fabricated by SIMOX Technology Mitsuru HARADA Tsuneo TSUKAHARA
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Regular Section

pp.559-561 LETTER-Electronic Circuits A 22-Gbit/s Static Decision IC Made with a Novel D-Type Flip-Flop Koichi NARAHARA Taiichi OTSUJI Masami TOKUMITSU
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pp.562-564 LETTER-Opto-Electronics Analysis and Simulation of Fiber Optic Temperature Sensor Using Mode-Division Multiplex Manabu YOSHIKAWA
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