Online ISSN :
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IEICE TRANSACTIONS on Electronics
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Volume E84-C No.12 (Publication Date:2001/12/01)
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Special Issue on Integrated Systems with New Concepts |
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pp.1746-1755 PAPER Interconnection of Stacked Layers by Bumpless Wiring in Wafer-Level Three-Dimensional Device Akinobu SATOH
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pp.1756-1762 INVITED PAPER Packaging Technology Trends and Challenges for System-in-Package Akihiro DOHYA
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pp.1763-1770 INVITED PAPER The Dawn of 3D Packaging as System-in-Package (SIP) Morihiro KADA
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Special Issue on New Technologies in Signal Processing for Electromagnetic-wave Sensing and Imaging |
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pp.1823-1828 INVITED PAPER Correlation-Based Continuous-Wave Technique for Optical Fiber Distributed Strain Measurement Using Brillouin Scattering with cm-Order Spatial Resolution--Applications to Smart Materials-- Kazuo HOTATE Masato TANAKA
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pp.1868-1876 PAPER The Effects of Micro Surface-Morphology on Bidirectional Reflection Distribution Function (BRDF) of Commercially Pure Titanium Sheets Mitsuo ISHII
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pp.1925-1931 PAPER Enhanced MUSIC Estimation of Delay Times by Wheel-Shaped Dipole Antennas Fumito WATANO
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pp.1932-1938 PAPER Complex-Valued Region-Based-Coupling Image Clustering Neural Networks for Interferometric Radar Image Processing Akira HIROSE Motoi MINAMI
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