IEICE Trans

IEICE TRANSACTIONS on Electronics

Volume E74-C No.8 (Publication Date:1991/08/25)

Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing

pp.2295-2296 FOREWORD FOREWORD Kuniaki TANAKA
	Summary \| Full Text:PDF >> Buy this Article

pp.2297-2300 INVITED PAPER High Density Packaging Technology Trend in Japan Fumio MIYASHIRO
	Summary \| Full Text:PDF >> Buy this Article

pp.2301-2308 PAPER-Multi Chip Module 1.8-Gb/s High-Speed Multichip Switching Module Using Copper-Polyimide Multilayer Substrate Naoaki YAMANAKA Takaaki OHSAKI Shiro KIKUCHI Taichi KON Shinichi SASAKI
	Summary \| Full Text:PDF >> Buy this Article

pp.2309-2316 PAPER-Multi Chip Module GaAs Multichip Package for Supercomputer Kazuhiko UMEZAWA Tukasa MIZUNO Hideki NISHIMORI
	Summary \| Full Text:PDF >> Buy this Article

pp.2317-2322 PAPER-Multi Chip Module Packaging Technology for HEMT LSI Devices Operated in Liquid Nitrogen Shigenori AOKI Yoshihiko IMANAKA Kishio YOKOUCHI Nobuo KAMEHARA
	Summary \| Full Text:PDF >> Buy this Article

pp.2323-2330 PAPER-Multi Chip Module A Silicon-Based Multichip Module with Co-Fired Aluminum Nitride Package Toshio SUDO Susumu KIMIJIMA Osamu SHIMADA Nobuo IWASE
	Summary \| Full Text:PDF >> Buy this Article

pp.2331-2336 PAPER-Packaging Technology for Main Frame High Performance Packaging Technology for Supercomputers Toshihiko WATARI Akihiro DOHYA
	Summary \| Full Text:PDF >> Buy this Article

pp.2337-2343 PAPER-Packaging Technology for Main Frame LSI Packaging Technology for Mainframe Computers Kenji TAKEDA Masahide HARADA Tsuyoshi FUJITA Takashi INOUE
	Summary \| Full Text:PDF >> Buy this Article

pp.2344-2348 PAPER-Interconnection A New Multilayer Ceramic-Frame Package for High-Frequency MMIC Modules Fuminori ISHITSUKA Nobuo SATO Haruhiko KATO
	Summary \| Full Text:PDF >> Buy this Article

pp.2349-2354 PAPER-Interconnection Thin Package of LSI by Transferred Bump TAB Technology Tetsuo KAWAKITA Kenzo HATADA
	Summary \| Full Text:PDF >> Buy this Article

pp.2355-2361 PAPER-Interconnection A Subminiature CCD Module Using a New Assembly Technique You KONDOH Masayuki SAITO
	Summary \| Full Text:PDF >> Buy this Article

pp.2362-2368 PAPER-Interconnection Flip-Chip Interconnection Technology for Packaging of VLSI Operated in Liquid Nitrogen Kaoru HASHIMOTO Masayuki OCHIAI Kazuaki KARASAWA Teru NAKANISHI
	Summary \| Full Text:PDF >> Buy this Article

pp.2369-2377 PAPER-Manufacturing Technology Development of Ultra Fine Wire and Fine Pitch Bonding Technology Toshimitsu YAMASHITA Takashi KANAMORI Yasuo IGUCHI Yoshinori ARAO Susumu SHIBATA Yasuhide OHNO Yoshio OHZEKI
	Summary \| Full Text:PDF >> Buy this Article

pp.2378-2383 PAPER-Manufacturing Technology Rheology and Printability of Solder Paste Shigeyuki OGATA
	Summary \| Full Text:PDF >> Buy this Article

Regular Section

pp.2384-2389 PAPER-Vacuum and Beam Technologies Data Compaction and Expansion Method for an Electron Beam Direct Writing System Using a Variably Shaped Line Beam Takayuki ABE Mineo GOTO Ryoichi YOSHIKAWA Susumu WATANABE Tadahiro TAKIGAWA
	Summary \| Full Text:PDF >> Buy this Article

pp.2390-2397 PAPER-Electromagnetic Theory Edge-Effect Theory in Mode-Matching Method for the Analysis of Printed-Circuit Waveguides Mikio TSUJI Hiroshi SHIGESAWA
	Summary \| Full Text:PDF >> Buy this Article

pp.2398-2409 PAPER-Electromagnetic Theory Scattering of Electromagnetic Plane Waves by a Grating Composed of Two Arbitrarily Oriented Conducting Strips in One Period Michinari SHIMODA Tokuya ITAKURA
	Summary \| Full Text:PDF >> Buy this Article