Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2012/12/01 Vol. E95-ANo. 12pp. 2284-2291 Type of Manuscript: Special Section PAPER (Special Section on VLSI Design and CAD Algorithms) Category: Device and Circuit Modeling and Analysis Keyword: LSI chip-package-board co-design, electromagnetic compatibility, power supply noise, power delivery network,