Yungseon EO

Compact CAD Models for the Signal Integrity Verification of Multi-Coupled Transmission Lines
Hyunsik KIM Yungseon EO 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2010/04/01
Vol. E93-A  No. 4  pp. 752-760
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
crosstalk, multi-coupled transmission lines, signal integrity, signal transient, simulation, 
 Summary | Full Text:PDF
Experimental Characterization and Modeling of Transmission Line Effects for High-Speed VLSI Circuit Interconnects
Woojin JIN Seongtae YOON Yungseon EO Jungsun KIM 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2000/05/25
Vol. E83-C  No. 5  pp. 728-735
Type of Manuscript:  Special Section PAPER (Special Issue on Recent Developments in Guided-Wave Problems)
Category: 
Keyword: 
IC interconnects, VLSI circuits, silicon substrate, s-parameters, proximity effect, 
 Summary | Full Text:PDF
Non-uniform Multi-Layer IC Interconnect Transmission Line Characterization for Fast Signal Transient Simulation of High-Speed/High-Density VLSI Circuits
Woojin JIN Hanjong YOO Yungseon EO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/06/25
Vol. E82-C  No. 6  pp. 955-966
Type of Manuscript:  Special Section PAPER (Special Issue on TCAD for Semiconductor Industries)
Category: 
Keyword: 
interconnect, substrate effect, shielding effect, signal integrity, signal delay, crosstalk noise, 
 Summary | Full Text:PDF