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Incentive-Stable Matching Protocol for Service Chain Placement in Multi-Operator Edge System
Jen-Yu WANG Li-Hsing YEN Juliana LIMAN | Publication:
Publication Date: 2022/11/01
Vol. E105-B
No. 11
pp. 1353-1360
Type of Manuscript:
Special Section PAPER (Special Section on Towards Management for Future Communications and Services in Conjunction with Main Topics of APNOMS2021)
Category:
Keyword:
service chain placement, edge computing, matching, | | | Summary | Full Text:PDF | |
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Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation
Yuchun MA Xin LI Yu WANG Xianlong HONG | Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/12/01
Vol. E92-A
No. 12
pp. 2979-2989
Type of Manuscript:
Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Desing
Keyword:
3D ICs, incremental floorplanning, thermal, MILP, | | | Summary | Full Text:PDF | |
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