Yoichi YOSHIDA

6 W/25 mm2 Wireless Power Transmission for Non-contact Wafer-Level Testing
Andrzej RADECKI Hayun CHUNG Yoichi YOSHIDA Noriyuki MIURA Tsunaaki SHIDEI Hiroki ISHIKURO Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/04/01
Vol. E95-C  No. 4  pp. 668-676
Type of Manuscript:  Special Section PAPER (Special Section on Solid-State Circuit Design – Architecture, Circuit, Device and Design Methodology)
Category: 
Keyword: 
inductive coupling, inductive power transfer, wafer-level testing, 
 Summary | Full Text:PDF
Analysis of Inductive Coupling and Design of Rectifier Circuit for Inter-Chip Wireless Power Link
Yuxiang YUAN Yoichi YOSHIDA Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2010/02/01
Vol. E93-C  No. 2  pp. 164-171
Type of Manuscript:  PAPER
Category: Electronic Circuits
Keyword: 
wireless power link, wireless power delivery, inductive-coupling, inductor, rectifier, SiP, 
 Summary | Full Text:PDF