Yasutoshi KURIHARA


Reliability of Sn-Sb Solder for Mounting Si Chip and Passive Elements on Insulated Metal Substrate
Yasutoshi KURIHARA Tsuneo ENDOH 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/03/25
Vol. E81-C  No. 3  pp. 439-446
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
reliabilitySn-Sb solderinsulated metal substrateSi chippassive element
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Copper Thick Film Conductor for Aluminum Nitride Substrates
Tsuneo ENDOH Yasutoshi KURIHARA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1996/06/25
Vol. E79-C  No. 6  pp. 845-852
Type of Manuscript:  PAPER
Category: Electronic Circuits
Keyword: 
hybrid ICceramicsaluminum nitridethick-filmcopper conductor
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