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Relay Transmission Thruchip Interface with Low-Skew 3D Clock Distribution Network Yasuhiro TAKE Tadahiro KURODA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2015/04/01
Vol. E98-C
No. 4
pp. 322-332
Type of Manuscript:
Special Section PAPER (Special Section on Solid-State Circuit Design---Architecture, Circuit, Device and Design Methodology) Category: Keyword: TCI, Coupled-resonator, 3-D Integration, 3-D clock distribution, CDR, | | Summary | Full Text:PDF(8.7MB) | |
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Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration Li-Chung HSU Masato MOTOMURA Yasuhiro TAKE Tadahiro KURODA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2015/04/01
Vol. E98-C
No. 4
pp. 288-297
Type of Manuscript:
Special Section PAPER (Special Section on Solid-State Circuit Design---Architecture, Circuit, Device and Design Methodology) Category: Keyword: TCI, ThruChip, 3-D FPGA, TSV, FPGA, TPR, VPR, | | Summary | Full Text:PDF(2.7MB) | |
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