Yasuhiro TAKE

A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel
Li-Chung HSU Junichiro KADOMOTO So HASEGAWA Atsutake KOSUGE Yasuhiro TAKE Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2015/12/01
Vol. E98-A  No. 12  pp. 2584-2591
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Design
Keyword: 
TCI, ThruChip, 3-D IC, TSV, inductive coupling interface, 
 Summary | Full Text:PDF(6.3MB)
Data-Transfer-Aware Design of an FPGA-Based Heterogeneous Multicore Platform with Custom Accelerators
Yasuhiro TAKEI Hasitha Muthumala WAIDYASOORIYA Masanori HARIYAMA Michitaka KAMEYAMA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2015/12/01
Vol. E98-A  No. 12  pp. 2658-2669
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
heterogeneous multicore, FPGA, custom accelerators, reconfigurable architecture, 
 Summary | Full Text:PDF(2.3MB)
Relay Transmission Thruchip Interface with Low-Skew 3D Clock Distribution Network
Yasuhiro TAKE Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2015/04/01
Vol. E98-C  No. 4  pp. 322-332
Type of Manuscript:  Special Section PAPER (Special Section on Solid-State Circuit Design---Architecture, Circuit, Device and Design Methodology)
Category: 
Keyword: 
TCI, Coupled-resonator, 3-D Integration, 3-D clock distribution, CDR, 
 Summary | Full Text:PDF(8.7MB)
Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration
Li-Chung HSU Masato MOTOMURA Yasuhiro TAKE Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2015/04/01
Vol. E98-C  No. 4  pp. 288-297
Type of Manuscript:  Special Section PAPER (Special Section on Solid-State Circuit Design---Architecture, Circuit, Device and Design Methodology)
Category: 
Keyword: 
TCI, ThruChip, 3-D FPGA, TSV, FPGA, TPR, VPR, 
 Summary | Full Text:PDF(2.7MB)
Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs
Hao ZHANG Hiroki MATSUTANI Yasuhiro TAKE Tadahiro KURODA Hideharu AMANO 
Publication:   IEICE TRANSACTIONS on Information and Systems
Publication Date: 2013/12/01
Vol. E96-D  No. 12  pp. 2753-2764
Type of Manuscript:  PAPER
Category: Computer System
Keyword: 
3-D network on chip (3-D NoC), wireless, inductive-coupling, low power, on/off vertical link, 
 Summary | Full Text:PDF(2MB)
Evaluation of an FPGA-Based Heterogeneous Multicore Platform with SIMD/MIMD Custom Accelerators
Yasuhiro TAKEI Hasitha Muthumala WAIDYASOORIYA Masanori HARIYAMA Michitaka KAMEYAMA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2013/12/01
Vol. E96-A  No. 12  pp. 2576-2586
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: High-Level Synthesis and System-Level Design
Keyword: 
heterogeneous multicore processor, FPGA, Multimedia processing, High-performance-computing, 
 Summary | Full Text:PDF(2.4MB)