Vincent SENEZ


Stress Engineering in Si Based Micro Structures Using Technology Computer-Aided Design
Vincent SENEZ Aldo ARMIGLIATO Giovanni CARLOTTI Gianpietro CARNEVALE Herve JAOUEN Ingrid De WOLF 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2003/03/01
Vol. E86-C  No. 3  pp. 284-294
Type of Manuscript:  INVITED PAPER (Special Issue on the 2002 IEEE International Conference on Simulation of Semiconductor Processes and Devices (SISPAD'02))
Category: 
Keyword: 
modelingstressesfinite elementsilicon technologiesfront/back end of line
 Summary | Full Text:PDF(2.7MB)

3-Dimensional Process Simulation of Thermal Annealing of Low Dose Implanted Dopants in Silicon
Vincent SENEZ Jerome HERBAUX Thomas HOFFMANN Evelyne LAMPIN 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2000/08/25
Vol. E83-C  No. 8  pp. 1267-1274
Type of Manuscript:  Special Section PAPER (Special Issue on 1999 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD'99))
Category: Process Modeling and Simulation
Keyword: 
diffusionfinite elementthree-dimensionalgear schemepoint-defectssilicon
 Summary | Full Text:PDF(8.3MB)